GTI Seminar
2023 08 03 @ FLEURLIS
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A1 - (Truechip) Artificial Intelligence Verification-The Future of Chip Verification
A2 - (Semitronix) Big Data Analytic Platform for smart manufacturing & design house
A3 - (Lorentz) 3DIC IC-CoWoS PKG Electromagnetic (EM) Co-Simulation using PeakView
A4 - (StarVision)StarVision PRO -- SoC, Multi-mode Debug for Transistor, RTL, and System-Level Designs
A5 - (Menta) Design adaptive eFPGA IP. The benefits of programmable logic without pain
A6 - (Semitronix) Data Driven IC Yield Enhancement Solution
B2 - (MAXEDA) Using AI to Design Chips - AI-assisted Floorplan Solutions
B3 - (MunEDA) Improve circuit design efficiency and quality with MunEDA ML-based EDA tools for migration, sizing & verification
B4 - (Vervesemi) Wide Bandwidth Analog-to-Digital Converter in Samsung LN08LPP with a novel time Interleaving algorithm to achieve performances suitable for 5G applications
B5 - (Altair) Altair FlowTracer - Mission-Critical Dependency Management
B6 - (MAXEDA) SoC Floorplan Exploration System
C1 - (Excellicon) Shift-Left Design Closure Methodology on SDC
C2 - (Secure-IC) Cyber-physical security from chip to cloud with PQC (Post-Quantum Cryptography)
C3 - (Aldec) Holistic Approach to Pre-Silicon Verification of Complex SoC and RISC-V Emulation Case-study
C4 - (Secure-IC) Multi-certified security technologies and application in Automotive, lightweight and high performance systems
C5 - (Secure-IC) How to be protected from Side-Channel Attacks? FIPS 140-3 compliance and hardware trojan detection
C6 - (IROC)Soft Error analysis and mitigation for high reliability application
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